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26 Layer, 11.4″ x 8.3″, 2 Sequential Lamination sections – B

Defining new machine's PCB Capabilities

 Our technology capabilities plan outlines the technologies offered as standard today and our future development activities. This overview showcases our product range and achievable tolerances, though it's not an exhaustive list.


For further information on the New Machine's PCB capabilities, contact us.

download technical capablities

New Machine Capability (pdf)

Download

Rigid PCB Capability

Basic

inner/outer layer

Laminates

  1. Layers : 1-60L
  2. Max Board Size :  1L, 2L, 1800 x 600mm | Multilayer 720 x 1200mm
  3.  Board Thickness Range (No UL Limits) DS+ML (mm) :  0.15 to 10mm 
  4.  Board Thickness Min. UL DS+ML (mm) :  DS: 0.08mm | ML: 0.15mm
  5.  Board Thickness Tolerance (mm) :  ±0.1mm T<=1.0mm | ±10%T T>1.0mm
     

Laminates

inner/outer layer

Laminates

  1.  FR4's Suppliers | UL Certified :  Shengyi, KB, nanYa, GW, nouya, ITEQ, Panasonic, Isola, Rogers, TUC, Ventec, Uniplus,  
  2.  Metal base Suppliers | UL Certified :  Polytronics, Shengyi, Ventec, Wazam, Boyu, Quanbao, Judeng, EMC, Chin-shi, Xingyuan 
  3.  Ceramic Material Suppliers | UL Certified :  Huaqing, Shengyi, Rogers, Arlon
     

inner/outer layer

inner/outer layer

inner/outer layer

  1.  Min. Line Width/Space (0.5oz) | Inner Layer :  0.05/0.05mm
  2.  Min. Line Width/Space (1.0oz) :  0.076/0.076mm
  3.  Min. Line Width/Space (2.0oz) :  0.127/0.127mm
  4.  Min. Line Width/Space (3.0oz) :  0.165/0.165mm
  5.  The Min. Distance Hole to Copper :  4L: 0.076mm； 6-8L: 0.1mm； 10-12L: 0.1mm； 10-16L: 0.15mm； 18-22L: 0.2mm； 24-28L: 0.254mm； ≥30L: 0.3mm

     

copper thickness

copper thickness

inner/outer layer

  1.  Copper Thickness | Inner Layer :  10.5-455um
  2.  Copper Thickness | UL Certified :  10.5-455um
  3.  Maximum Copper Thickness | Outer Layer :  420um 

drilling

copper thickness

drilling

  1.  Drill Bits Range :  0.1 - 6.5mm
  2.  Slot Tolerance :  PTH slot ±0.075mm | NPTH slot ±0.05mm
  3.  Minimum Slot Width :  0.2mm 
  4.  Multi Drilling, Min. Slot Relation Length - Width (1-1.1 is /t possible) :  1.2:1
  5.  The Min. Distance Between Vias Wall in Different Net :  The Same Net: 0.15mm | Different Net: 0.254mm
  6.  Hole Wall Roughness Can Control (<) :  0.025m
  7.  The Min. Depth for Control Routed :  0.15mm 

plating

copper thickness

drilling

  1.  The Max. Aspect Ratio :  25:1
  2.  PTH Hole Size Minimum Tolerance :  ±0.05mm
     

Solder mask

Solder mask

Solder mask

  1.  Colour for Soldermask :  Green, Yellow, Black, Blue, Red, White, Matt Green, Matt Black, Purple, Orange, Transparent, Grey
  2.  Suppliers for Soldermask | UL Certified :  Taiyo, Kuangshun, ABQ, Rongda, Coants, nanya, Tamura, Onstatic, Advance, Yanmo, Greencure
  3.  Solder Mask Process: Screen Printing, Spray Coating, Curtain Coating, Direct Printing :  Screen Printing, Spray Coating, Inkjet, Curtain Coating
  4.  Soldermask Thickness :  5-60um
  5.  Plumpness for Soldermask Plug :  90%
  6.  Plumpness for Resin Plug:  100%

     

silk screen

Solder mask

Solder mask

  1.  Available Silkscreen Colour :   White, Yellow, Black, Red, Green, Blue
  2.  Available Surface Finishes :  OSP, HASL-LF, HASL, ENIG, Immersion Tin, Immersion Silver, Gold Finger
     

OSP & HASL

Solder mask

IMMERSION GOLD

  1.  The Max. Working Panel | OSP :  622x1200mm 
  2.  The Min. Working Panel :  30x30mm
  3.  The Max. Board Thickness :  6mm 
  4.  The Min. Board Thickness :  0.2mm 
  5.  The Thickness for OSP :   0.2-0.6um
  6. The Max. Working Panel | HASL :  622×728mm
  7. The Max. Board Thickness :  7.0mm 
  8.  The Min. Board Thickness :  0.4mm 
  9.  Tin Thickness on Surface :  1-50um
  10.  Tin Thickness in Hole :  1-40um
  11.  PB Free HASL :  Yes



IMMERSION GOLD

IMMERSION GOLD

IMMERSION GOLD

  1.  The Max. Working Panel | Immersion Gold :  700x1000mm
  2.  The Max. Board Thickness :  7mm 
  3.  The Min. Board Thickness :  0.2mm 
  4.  Au Thickness :  0.025-0.125um
  5.  Ni Thickness :  2-12um

IMMERSION TIN

IMMERSION GOLD

IMMERSION TIN

  1.  The Max. Working Panel | Immersion Tin :  610mmx1500mm 
  2.  The Min. Working Panel :  50x50mm
  3.  The Max. Board Thickness :  7mm
  4.  The Min. Board Thickness :  0.2mm
  5.  Tin Thickness :  0.2-1.5um

IMMERSION AG

IMMERSION GOLD

IMMERSION TIN

  1.  The Max. Working Panel | Immersion Ag :  610mmx1500mm
  2.  The Min. Working Panel :  50x50mm
  3.  The Max. Board Thickness :  5.0mm
  4.  The Min. Board Thickness :  0.2mm
  5.  Ag Thickness :  0.1-0.75um

     

GOLD FINGER

routing/v cut

routing/v cut

  1.  Au Thickness | Gold Finger :  1~100u"
  2.  Ni Thickness :  2-10um
  3.  Chamfer Angle :  15°- 60°
  4.  Chamfer Length :  0.1-3.0mm
  5.  Chamfer Length Tolerance :  ±0.075mm

routing/v cut

routing/v cut

routing/v cut

  1.  Routing | Profile Tolerance :  ±0.1mm
  2.  The Min. Router Bit :  0.6mm
  3.  Jump V-Score :  Yes 
  4.  The Min. Distance for Jump V-Score :  6mm 
  5.  The Max. Working Panel :  850x1500mm
  6.  The Max. Board Thickness :  4.20mm
  7.  The Tolerance for V-Score Remain Thickness :  ±0.05mm
  8.  Angle :  20°- 90°
  9.  The Accuracy for the V-Score Both Sides :   :  ±0.05mm

bow and Twist

routing/v cut

buried capacitance

  1.  Bow & Twist | Min. :  0.30%

 

buried capacitance

length for gold Finger

buried capacitance

  1.  Capacitance Material (3M C-PLY, Sanjing, Other) :  Sample 
  2.  Single Etch or Double Etch :  Single 
  3.  The Max. Layers for Capacitance :  10L 

length for gold Finger

length for gold Finger

length for gold Finger

  1.  Etch Method After Gold Plating:  Yes 
  2.  Tie Line for Inner Layer Method :  Yes 
  3.  Gold Plate all Around the Fingers :  Yes 

peel able solder mask

length for gold Finger

length for gold Finger

  1.  Peelable Soldermask | SD2955 :  Yes 
  2.  Carbon Print :  Yes 
  3.  The Resistance Value Control (ohms/square) :  8Ω-50Ω | Tamura, Acheson, Asahi, Sheng Tian Feng, Chuandao

     

hybrid lamination

hybrid lamination

hybrid lamination

  1.  FR4 and Rogers | Hybrid Lamination:  FR4+Ro4350B | FR4+Ro4730G (Yes UL) | Other Hybrid Structure: Yes (No UL)
  2.  FR4 and PTFE :  

Yes (No UL)

 

Metal base

hybrid lamination

hybrid lamination

  1.  AL Base + Thermal Conductivity Range | Metal Base :  Yes 
  2.  Copper Base :  Copper Base
     

heavy copper

heavy copper

heavy copper

  1.  Inner Layers (UL) | Heavy Copper :  Yes 
  2.  Outer layers (UL) :  Yes 
  3. Copper Via fill : Yes

Others

heavy copper

heavy copper

  1. Resin Filling & Cap: Yes
  2.  Accuracy | Blind Holes Mechanical :  ±0.05m
  3.  Aspect Ratio :  15:1
  4.  ?+N+? (Max. Number you can Build) | Sequential Buildup :  6+N+6
     

HDI Capability

material

board thickness

board thickness

  1.  HDI | Raw Material Type (UL) :  S1141, S1000H, S1000-2M, S1150G, R-5775, 480HR, 370HR, RO4350B, TU-883, TU-993, NP175F, HTE-800 :
  2.  HDI | Raw Material Prepreg Type (UL) :  106, 106H, 1080, 1080H, 2113, 2116

board thickness

board thickness

board thickness

  1.  The Max. Board Thickness :  6mm 
  2.  The Min. Board Thickness :  0.2mm 
  3.  The Min. Board Thickness UL :  0.1mm

layers

board thickness

Inner layer

  1. Max Layers: 60L
  2. Sequential :  Yes 
  3. Anylayer : Yes
  4.  Max. X+N+X :  6+N+6
  5.  Stacked Vias, Staggered Vias :  Yes 
  6.  Coupon for Micro Section :  Yes 

Inner layer

Laser drilling

Inner layer

  1.  Min. Line Width/Space :  0.045/0.045mm
  2.  The Min. Distance Hole to Copper :  0.1mm 

outer layer

Laser drilling

Laser drilling

  1.  Min. Line Width/Space :  0.045/0.045mm
  2.  Min. Line Width/Space | UL Certified :  0.0635/0.0635mm
  3.  The Min. Distance Hole to Copper:  0.1mm

Laser drilling

Laser drilling

Laser drilling

  1.  The Min. Laser Vias :  0.075mm
  2.  The Max. Laser Vias :  0.2mm
  3.  Aspect Ratio Depth: Diameter:  1:0.75
  4.  LDD  :  yes
  5.  Large Window : yes

copper filling

copper filling

copper filling

  1.  Max. Hole Diameter:  0.15mm
  2.  Min. Copper Foil (1/4oz,1/3oz,3/8oz) | UL Certified :  8um,12um,13um
  3.  Min. Copper Foil (1/4oz,1/3oz,3/8oz) | UL Certified :  12um 

Flex capability

material

board thickness

board thickness

  1. Max Layer : 8L 
  2.  Stackup | UL Certified (In case of more, please provide) :  1L, 2L, 4L, 6L, 8L | FCCL(Shengyi) +Coverlay (Shengyi) | FCCL (Thinflex) +Coverlay (Xingao)
  3.  Max. PCB Size for Shipping :  750x500mm
  4.  Min. PCB Size for Shipping :  2x2mm 

 

board thickness

board thickness

board thickness

  1.  The Max. Board Thickness | UL Certified :  0.8mm 
  2.  The Min. Board Thickness | UL Certified :  0.06mm
  3.  Double Side :  +/-0.025mm
  4.  Multilayer :  ±0.05mm
     

Material

board thickness

drill & base copper

  1.  Material PCB Supplier | UL Approved :  Taiflex, Shengyi, ITEQ, Thinflex, Panasonic, SY, Dupont, PI
  2.  Material PCB Supplier | UL Not Approved :  Allstar, Jujiang
  3.  Type Material with Adhesive :  Taiflex, Shengyi, Thinflex
  4.  Type Material Without Adhesive :  Taiflex, Shengyi, ITEQ, Thinflex, Panasonic, SY, Dupont, Lianmao, Taihong
     

drill & base copper

drill & base copper

drill & base copper

  1.  Min. Hole Size :  0.1mm 
  2.  Max. Hole Size :  6.4mm
  3.  Hole Size Tolerance :  ±0.05mm
  4.  Max. Aspect Ratio :  Max. Aspect Ratio
  5.  1/3oz Or 1/4oz Capable + UL Certified :  12um 
  6.  Max. Base Copper Capable + UL Certified :  70um
     

profile

drill & base copper

cover lay

  1.  Profile Tolerance :  ±0.075mm
  2.  Routed Method (Laser, Punch) :  CNC, Punch, Laser, Precision Die

cover lay

drill & base copper

cover lay

  1.  Min. Thickness | Coverlay:  12.5um
  2.  Max. Thickness :  75um
  3.  Min. Open Window :  0.1mm 
  4.  Cover Layer Type:  0515/0520/0525/1025/1035/1050
  5.  The Tolerance for Coverlay Registration :  ±12.7um
  6.  The Registration for Coverlay :  ±0.05mm

line width/spacing

surface finish/impednace

line width/spacing

  1.  0.5oz Base Copper for Double Sides & Multilayer | UL Certified | Line Width/Spacing :  0.05/0.05mm
  2.  0.5oz Base Copper for Single Side | UL Certified :  0.05/0.05mm
  3.   1.0oz Base Copper for Double Sides & Multilayer | UL Certified :  0.076/0.076mm
  4.  1.0oz Base Copper for Single Side | UL Certified
    :  0.076/0.076mm
  5.  1/3oz, 1/4oz Base Copper | UL Certified:  0.043mm/0.043mm

etch/soldermask

surface finish/impednace

line width/spacing

  1.  Etch Tolerance:  ±10%
  2.  The Pattern Accuracy :  0.0275mm
  3.  Colour | Soldermask | UL Certified :  Black, Blue, Yellow, Green, White
  4.  The Registration for Soldermask:  ±0.05mm
  5.  Min. Thickness :  5um

surface finish/impednace

surface finish/impednace

surface finish/impednace

  1.  OSP Thickness | Surface Finish :  0.1-0.5um
  2.  Gold Plate | IPC Standard :  Yes 
  3.  ENIG | IPC Standard :  Yes 
  4.  Immersion Tin | IPC Standard :  Yes 
  5.  Impedance Tolerance :  ±10%

Rigid Flex capability

Basic

  1. Max Layer : 36L
  2.  Max. PCB Size :  500x610mm
  3.  Min. PCB Size :  2.5x2.5mm
  4.  Max. Board Thickness :  6.0mm 
  5.  Min. Board Thickness | UL Certified :  0.1mm 
  6.  Most Core : 6
  7.  Symmetry : yes
  8.  Non-Symmetry : Yes
  9.  Tail Fly : Yes
  10.  Air Gap : yes
  11. Other: yes

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